On the Line with...

Qnity may be a new name in advanced electronics materials, but the technology behind it is anything but new. Separated from DuPont in November 2025, Qnity brings decades of materials science and some of the electronics industry's most recognizable material platforms into a company focused exclusively on semiconductor and electronics manufacturing. In this foundational episode of On the Line With… Qnity, Marcy LaRont talks with Jake Joo about the company's heritage, its Advanced Flex Technologies business, and the long history behind familiar names like Kapton® polyimide films and Pyralux® flex circuit laminates and adhesive systems. From materials that have traveled to Mars to today's increasingly complex consumer electronics and AI systems, we explore how Qnity is building on that legacy and helping OEMs and fabricators solve problems at the system level.

In the series wrap-up, Marcy LaRont discusses with CTO Kirk Thompson the turning point facing the PCB industry as innovation speeds up. With increasing data rates, power density, AI infrastructure, flexible electronics, photonics, and chiplet integration, traditional material assumptions are no longer enough. Kirk explains how advanced materials now enable higher speeds, better thermal management, and more precise dimensional control, while balancing manufacturability. The merging of PCBs and advanced packaging is both exciting and challenging, requiring substrate-like precision at scale. In the end, early collaboration across the ecosystem and smarter, more integrated materials will shape the next generation of cutting-edge PCBs.

Lessons learned from recent global supply chain disruptions. Drawing on recent events to shed light on current issues, Jim explains that many supply chain weaknesses experienced during the COVID-19 pandemic were structural, as geographic and supplier-base efficiency had been prioritized over resilience. However, achieving true resilience requires diversification, scenario planning, strategic inventory, and strong partnerships. Jim states that supply chain volatility is now constant, and companies must institutionalize lessons learned to stay prepared.

Marcy LaRont speaks with Laura Martin, Director of Strategic Markets at Isola, about PCB reliability in harsh environments across aerospace, automotive, and defense applications. Martin explains that reliability under pressure involves managing cyclic strain within composite materials—not just meeting temperature limits. Thermal cycling, Z-axis expansion, moisture under bias, and anisotropic behavior all contribute to long-term fatigue and failure. Common failure mechanisms such as plated through-hole cracking and interfacial delamination are discussed, highlighting the increasing importance of material selection based on strain management rather than just Tg. The conversation emphasizes designing for real-world stress factors to ensure long-term durability and performance.

As each area of electronics and manufacturing take a more serious look at sustainability and end product circularity, the base material of the PCB should in central in that discussion. In this episode of On the Line with, Isola’s Kirk Thompson explains the “green circuit,” new directions in materials and engineering that address important environmental impact issues such as the amount of energy it takes to process a particular material type, or how much copper is wasted in the process. As engineers seek materials that minimize VOC emissions or are designed for cleaner fabrication, there are many factors to consider. From halogen-free to PFAS to simply avoiding unnecessary extra layers in your board, Kirk has a lot of information you will want to hear.