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For first episode of 2023, Françoise von Trapp handed over the microphone to Dean Freeman, the market analyst at 3D InCites. He attended SEMI’s Industry Strategy Symposium at Half Moon Bay, CA, in January and interviewed SEMI’s Market Intelligence team for the third episode in this four-part series. Part 3 focuses on the Semiconductor Manufacturing Monitor, a report jointly developed by SEMI and TechInsights. SEMI ISS is an annual event attended by semiconductor industry executives who rely on it for updates on many crucial aspects of semiconductor industry operations. As such, Dean and the panelists discuss some of the key market intelligence takeaways from this ISS 2022 before delving into the report. Panelists include:·       Inna Skvortsova, Market Research Analyst in the SEMI Market Intelligence Team·       Risto Puhaka, Director of Market Research, Market Research TechInsights ·       David Ghodsizadeh, Director of Product Marketing for the SEMI Market Intelligence TeamLearn more about SEMI's Market Intelligence TeamLearn more about the Semiconductor Manufacturing Monitor Order a sample of the Semiconductor Manufacturing MonitorSEMI A global association, SEMI represents the entire electronics manufacturing and design supply chain. Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
This episode was recorded live during the Advanced Packaging Sympoisium at SEMICON Europa on November 16. 2022. Steffen Kröhnert, President & Founder, ESPAT-Consulting, moderates a panel discussion with members of the semiconductor packaging service provider community in Europe. The topic? The Future of semiconductor manufacturing in Europe – and specifically, back-end packaging and test. Kröhnert sets the stage by providing an overview of the current availability of semiconductor packaging in Europe. Panelists Oliver Maiwald, CEO, Sencio B.V. and Jan de Koning Gans, Managing Director, RoodMicrotec GmbH, talk about their respective offerings, and discuss the desire to build a robust packaging ecosystem to support the European semiconductor supply chain. Q&A with audience wraps up the conversation.  Contact the Panel on LinkedIn:Steffen Kröhnert, President & Founder, ESPAT-Consulting   Oliver Maiwald, CEO, Sencio B.V.Jan de Koning Gans, Managing Director, RoodMicrotec GmbH            Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
In this episode recorded live at SEMICON Europa 2022, Françoise hands over the mike to Cassandra Melvin, Senior Director of Business Development and Operations at SEMI Europe. At SEMICON Europa, Cassandra led a panel discussion on the topic of Leveraging Generational Differences in the Shifting Workplace. The panel comprised industry professionals representing different generational cohorts, from Baby Boomers to Gen-Z. We recorded it in its entirety. Meet the Panellists   Cassandra Melvin, Moderator, SEMI EuropeFrancoise Chombar, Chairwoman, MelexisPhilip Matthes, Head of Global Human Resources, Semiconductor Materials, Merck KGaA, Darmstadt GermanyMark Agujar, Project Technician, Edwards Vacuum Marco Fasel, Industrialization Team Leader, Comet PCTLike what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
In this episode, recorded live at SEMICON Europa in Munich the week of November 14-18, 2022, Françoise von Trapp speaks with 3D InCites member companies that either exhibited, presented, or in some cases, both, at the event. Conversations range from discussions about this year's event compared with the 2021 show, the impact of the respective EU and US CHIPS and Acts on their businesses, and the technology innovations they showcased at the show.  Guests and CompaniesPeter Dijkstra of Trymax  Alan Weber of Cimetrix by PDF Solutions  Dieter Rathei and Krista Tropper of D.R. YieldThomas Fries of FormFactorHeiko Dudek of Siemens EDA and Raphael Theveniau of ST Microelectronics Jim Garstka of PlasmaTherm Byron Exarcos and John Voltz of ClassOne Technology Ralph Zoberbier of Evatec  Debbie Claire Sanchez and Sophia Oldeide of ERS electronic GmbH Jim Straus and  Sally-Ann Henry of ACM ResearchRam Trichur of  Henkel Corporation  Mike Rosa of Onto Innovation  FInd these Articles on 3D InCitesThe Road Towards Climate Neutrality from the Perspective of a German SME Mobile Antennas and Power Devices that Break The Mold Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
This podcast episode was recorded live at SEMICON Europa 2022, in Munich Germany. It features interviews with select keynote speakers representing the depth and breadth of topics discussed throughout the week. Luc Van den hove, President and CEO of imec, in Belgium talks about the rollercoaster ride we’ve been on in the aftermath of the pandemic, the war in Ukraine, the subsequent energy crisis, and financial crisis, and how this has propelled semiconductors into the limelight. He also explained how semiconductors enabled the ability to generate and analyze gigabytes of data using AI to quickly sequence the human genome, and how that made it possible to develop a COVID vaccine in just one year, as well as other examples of how semiconductors are helping to drive change in global challenges like the climate crisis, health, and food supplies.  Laura Matz, CEO of Athinia, returns to the podcast to talk about the importance of developing a data ecosystem to bring materials suppliers and device manufacturers together to collaborate. Since then, she’s been exploring other areas of semiconductor manufacturing, such as supply chain and sustainability.Michelle Williams-Vaden, of SEMI Foundation, spoke about the talk she gave during the Future of Work session on how companies can shift to welcome a more inclusive workforce. She provides some strategies on how to attract new talent and create a devoted team. Isabella Drolz, of Comet Yxlon, talks about how X-ray technology is the future of inspection in advanced packaging. She explains why there hasn’t been an industry-wide adoption of X-ray inspection as the preferred method. Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
In this episode, Françoise speaks with Beth Keser, Ph.D., about her latest book co-authored with Steffen Kröhnert, ESPAT Consulting.  Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces was published in December 2021. It is essentially a companion to the wafer-level packaging handbook titled, Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies, which the duo published in 2019. This book picks up where the first one left off, with 11 new chapters including contributions from some of the same companies that participated before, as well as new ones.  The book examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges, and is filled with contributions from some of the field’s leading experts.In the interview, Beth talks about the book’s backstory, why and how it was written, and who participated. She also explains why they decided to begin the book with a market report, and how the book is a snapshot in time. Contact Beth Keser on LinkedInOrder your own copy of Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces.Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
According to the International Energy Agency, road transportation accounts for 16% of global emissions. Electric vehicles are the key technology to decarbonize this. The EIA estimates that EVs will account for 13% of new cars sold in 2022. Many countries are setting goals to eliminate combustion engine cars to reach Net Zero emissions by 2050. But there are a lot of challenges to iron out before EVs achieve critical mass. For example, one area of interest for this week’s podcast guests is the materials used to manufacture EV power modules. In this episode, Françoise von Trapp talks with Indium’s Pei Lim and Dean Payne about these challenges, particularly why pressure silver sintering is becoming a popular approach for die attach in power packaging applications.  You’ll learn how eMobility has impacted manufacturing power modules and the origin of silver sintering in these devices. You’ll learn about the materials currently used in sintering, and why silver is a better choice for electric vehicles. Lastly, you’ll learn about Indium’s pressure sinter offering and its benefits. Learn more about pressure silver sintering here. Contact today’s guests on LinkedIn: Sze Pei Lim, Senior Global Product Manager, Indium Corporation Dean Payne, Semiconductor Product Manager, Indium Corporation.Indium Corporation Indium Corporation's materials solutions serve the semiconductor, e-mobility, and thermal markets.Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
For this episode, recorded during the IMAPS International Symposium, Françoise von Trapp hands over the mike to Robin Davis, of 3D InCites Member company, Deca. Davis organized and moderated a Diversity, Equity, and Inclusion town hall discussion during IMAPS, on the topic of Equality vs. Equity. A distinguished panel of industry veterans shared their perceptions and personal stories, including Jean Trewhella, GlobalFoundries; Susan Trulli, Raytheon; Shelby Nelson, Mosaic Microsystems; Urmi Ray, Saras Micro Devices, and KT Moore, Cadence. Davis provided a framework for the conversation, explaining the difference between Equal and Equity: Equality means each employee gets the same bicycle to ride, and equity means that everyone gets the bicycle that suits their needs. The panelists then also offered tips for how to overcome our own unconscious bias to create a culture of DEI at our own workplaces.Contact the Panelists on LinkedInRobin Davis, Deca Jean Trewhella, GlobalFoundriesSusan Trulli, RatheonShelby Nelson, Mosaic Microsystems Urmi Ray, Saras MicrodevicesKT Moore, Cadence Deca Deca's technology empowers the transformation of electronic interconnects for the chiplet era. Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
25 of our community members participated in the 2022 IMAPS International Symposium in Boston, MA, which was held during the first week of October. This episode features conversations about what they were presenting and showcasing, and what they learned during the week.  Craig North, of Gel-Pak, is on a mission to find out as much as he can about chiplet processes and technology, to identify gaps that can be filled by Gel Pak products and services.  Bob Connor and Kevin Oswalt of X-Celeprint. Kevin talked about the paper he presented at IMAPS on micro-transfer printing (MTP) at the conference and creating the III_V heterogeneous integration ecosystem. Bill Acito, of Member company Siemens, presented on silicon substrate design for BGA designers. Carlotta Baumann, the new CEO of Finetech, talks about stepping into the role in the midst of COVID, and into the shoes of a 22-year veteran not only as a woman but as the sole owner of the company.Tim Olson, CEO of Deca, was awarded the IMAPS Founder Award. To celebrate, we took a walk down memory lane to share Deca’s origin story and how the company has evolved over the years. Casey Krawiec and Tim Going of StratEdge Corporation,  talked about the new die-on-tab service they are offering for customers who want to incorporate GaAn die into hybrid packaging. They’ve got some interesting products coming down the pipelines in space and defense applications. Keith Best, of our member company Onto Innovation, talked about the company’s presentation on RDL inspection, which is difficult to inspect because of metal grain. He explained how Onto Innovation’s ClearFind technology uses a green laser to make metal black and organics white, to make the defects easier to see.  Dick Otte, QP Technologies, returns to the podcast to offer some insight on the CHIPS and Science Act.  He talks about who customers will be as an outcome of the government investment, and what can be done to take advantage of them,IMAPS International IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
in this episode, Françoise von Trapp interviews three of the keynote speakers who presented during the 2022 IMAPS International Symposium. Featured guests include Lionel Kimmerling, Dr. Anu Agarwal (MIT Microphotonics Center); Glenn Daves (NXP), and Dave Bolognia (Analog Devices).We’re back on the road – recording a series of episodes at the IMAPS International Symposium. In this first episode, Françoise interviews some of the keynote speakers to capture the highlights of their talks. First up, is Lionel Kimmerling, Thomas Lord Professor of Materials Science and Engineering Director at MIT Microphotonics Center, and his colleague, Dr. Anu Agarwal, MIT – Director of Electric Photonic Packaging and principal research scientist. They explain the basics of Si photonics and co-packaged optics, and the advantages and opportunities of electronic-photonic package integration, which is expected to be the next big technology transition in the IC field, particularly when it comes to chip stacking.  Additionally, Dr. Agarwal talks about a partnership between the Microphotonics Center and IMAPS to provide an educational setting to provide hands-on-training to help the packaging engineer workforce to develop the new skills  Glenn Daves of NXP gave the keynote on Day 2 on the topic of 6G – It’s Opportunities and Packaging Challenges. He talks about the promise of 6G and why it’s more than just another “G” and explains what the plans are for 6G applications. We also talk about all that needs to be accomplished to stay on track to integrate 6G into the wireless offerings, and what’s needed specifically from the packaging community t support it. Lastly, he talks about the importance of semiconductor sustainability and the opportunity to design sustainability into 6G from the get-go.  Dave Bolognia of Analog Devices talks about advancing medical electronics at the intelligent edge. He explains what he means by the intelligent edge; how data volumes are driving the need for more processing at the edge, and the medical applications that will benefit from it. Contact Our Guests: Lionel Kimmerling, MIT Microphotonics CenterAnu Agarwal, Ph.D., MIT Microphotonics Center Glenn Daves, NXP SemiconductorsDave Bolognia, Analog Devices IMAPS International IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
It’s no secret that semiconductors are very much a male-dominated industry. In fact, according to Zippia, only 10.7% of engineers working in the semiconductor industry are women. And according to Deloitte and Touche’s Women in the Workplace, women are still vastly underrepresented at all levels of management. In this episode, Françoise von Trapp talks with Christine Whitman, a semiconductor executive who has broken through these barriers. She’s the chairman and CEO of our member company. Mosaic Microsystems.In this episode, Christine shares her origin story. She talks about what inspired her to pursue a career in semiconductors, and the career path she took that resulted in her buying her first company. A self-described serial entrepreneur, she talks about her passion for materials science, what she looks for when investing in a start-up, and what led her to found Mosaic Microsystems. She also shares her vision for the future, and advice for women looking to shatter the glass ceiling. About Mosaic MicrosystemsMosaic is pioneering thin glass for packaging and interposer applications in fields ranging from millimeter-wave communications to artificial intelligence and photonics. Thin glass has outstanding mechanical and electrical properties for today’s packaging applications, but adoption has been slow due to its fragility and flexibility. Mosaic’s Viaffirm handling solution eliminates these roadblocks by making thin glass compatible with standard semiconductor processes. Viaffirm also provides a platform for through glass vias and void-free via fill, enabling glass-based interposers with capabilities normally reserved for silicon. Learn more about Christine Whitman here. Mosaic Microsystems: The Future is Clear Thin glass solutions for next-generation microelectronics and photonics packaging. Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
In this episode, Françoise speaks with Riko Radojcic, veteran semiconductor engineer-turned-novelist, about his 30-year career in the semiconductor industry, what inspired him to turn to fiction writing, and what he hopes to teach his readers about the exciting world of semiconductor device technology.  Ever since the chip shortage impacted your local car dealership, everyone in the world knows how critical semiconductor technology is to every person on the planet. They may not understand anything else about them. But the fact that they are critical to our everyday activities is clear. But before all this happened, one well-known 3D technology expert at Qualcomm felt a calling to teach the general public about the wonders of semiconductor chips and their capabilities through storytelling.   He left his career in engineering and set out to become a techno-thriller novelist, in which his heroes are semiconductor engineers who must save the world from imminent destruction. Kind of like we’re trying to do in real life. His name is Riko Radojcic, In this episode, he shares his journey as a semiconductor engineer, and talks about about his latest novel, Start-Up. Learn more about Riko Radojcic and where to find his books here.Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
This SEMI Market intelligence Report podcast features Sanjay Malhotra, Vice President of SEMI’s Corporate Marketing and the Market Intelligence Team (MIT), and Christian Dieseldorff, Senior Principal Analyst. The conversation focuses on the World Fab Forecast, its history, how data is gathered, and how semiconductor manufacturers and suppliers use it to guide their business decisions. Sanjay starts things off by recapping the Market Symposium at SEMICON West, and the midyear forecast presented there. He also shares how he used the World Fab Forecast during his years in the industry. Christian talks about the outlook for new fabs and fab expansions, and how much this activity represents future capacity increases from both an actual and historical standpoint. Most importantly, he and Sanjay put fab expansion numbers and capacity into context. Lastly, Christian talks about the impact of the US CHIPS and Science Act, and other global incentives around the world. He and Sanjay provide some valuable insights to consider when reviewing the World Fab Forecast to help listeners make the most of this useful tool. You can learn more about SEMI Market Reports here.  For specific questions, email the Market Intelligence team at mktstats@semi.org. Find our Guests on LinkedIn: Sanjay Malhotra, VP of Corporate Marketing and the MITChristian Dieseldorff, Senior Principal Analyst, MITSEMI A global association, SEMI represents the entire electronics manufacturing and design supply chain. Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
In this episode, Françoise speaks with Dr. Juan Terrazas, the Director of the College of Engineering at CETYS University about the benefits of cross-border manufacturing relationships between the US and Mexico to help alleviate the strains of the semiconductor crisis. In the aftermath of President Biden’s signing of the CHIPS and Science Act, we’ve been seeing news articles about Mexico positioning itself to take advantage of the US’s desire to bring semiconductor manufacturing closer to home. According to these reports, Mexico is starting to offer incentives to tempt semiconductor manufacturers to open facilities there. The country is already the eighth largest producer of electronics. It’s also close to where companies like Intel and Samsung are already planning new facilities. Many of these activities began before the chip crisis, with the onshoring efforts and the SHIP program we’ve talked about before on the podcast. Dr. Terrazas provides some insight on the microelectronics manufacturing capabilities in Mexico, and how the US can leverage these capabilities to bolster our domestic semiconductor supply chain. He also talks about the growing technical talent pool that can help solve some of the growing semiconductor workforce challenges.  Learn more CETYS University hereContact our Guest on LinkedInDr. Juan Terrazas Gaynor, Director of Engineering, CETYS UniversityLike what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
 The IMAPS International Symposium takes place October 4-7, 2022 at the Hynes Auditorium in Boston MA.  This year's Symposium theme is Packaging Technologies Enabling the New Normal, and will feature 20 sessions in five technical tracks, plus an Interactive Poster Session. The technical program will span three days of sessions with an emphasis on packaging technologies that serve 5G, High-Performance Computations, Automotive, Industrial, Defense/Space, Medical electronics markets, and beyond.  New this year will be a workshop on Strategies to Revitalize the Onshore Packaging and Assembly Defense Industrial Base, a Workforce Development Panel discussion, and a DEI Townhall discussion and reception, Equity and Equality in the Workplace. In this episode, Françoise speaks with Beth Keser, President of IMAPS, and Jim Haley IMAPS VP of Marketing, who dive into the details of this year’s event.  To learn  more about the event or to register, visit the IMAPS Symposium Website Connect with our guests on LinkedIn Beth Keser James HaleyLike what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Earlier this year, we brought you an episode about Roadtrip Nation – an initiative the SEMI Foundation sponsored to raise awareness among recent STEM graduates about opportunities in the semiconductor industry. We interviewed SEMI Foundation’s Shari Liss, to get all the details. You can listen to the episode here. In this follow-up episode, we’re speaking with TEL’s Katy Crist, who heads up the company’s workforce development initiative, and Tara Greig, an intern at TEL who was selected as one of the lucky candidates who participated in this year’s Roadtrip Nation.   Katy talks about the importance of the Roadtrip Nation project to SEMI’s image and awareness campaign about the semiconductor industry as a great career path. She also talks about TEL’s involvement. Two-thirds of the way through the experience, Tara shares some highlights of her experience and the journey from applying to the program through the actual three-week adventure, the people she met, the connections and relationships she made, and also provides tips for future applicants who might want to take advantage of this amazing program.Roadtrip Nation is a nonprofit organization that humanizes career exploration through storytelling and empowers individuals to connect their interests to fulfilling lives and careers.Learn more Find our Guests on LinkedINKaty Crist, Sr. Manager, Strategic Alliances and Partnerships, TELTara Greig, Business Informatics Intern, TELTEL Tokyo Electron (TEL) provides innovative semiconductor and flat panel display production equipment. Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
This podcast episode was recorded live at SEMICON West 2022 at the Moscone Center in San Francisco, where critical discussions about the latest issues impacting the semiconductor industry took place.  Chips aren’t the only thing in short supply, the semiconductor industry talent shortage continues, and SEMI has launched a workforce initiative to address this. In this episode, Françoise von Trapp speaks with General Paul Funk and Major Ray Willson of the United States Army; and Larry Smith, Chairman of the board at TEL, who participated in a panel discussion at SEMICON West on the role military veterans can play in shoring up the microelectronics workforce. All three guests share their Army stories, what it means to be a soldier for life, and about the important connections made there. They also talk about helping transitioning veterans from the military to civilian life, and what makes them so well suited for positions in microelectronics. Smith provides a recap of the SEMI panel, who participated, and some of the key takeaways. He talked about the semiconductor industry workforce image and awareness program, and how partnering with military veterans’ programs can form important connections that help veterans learn about the employment opportunities available to them.  General Funk talks about the lifelong connections that a career in the army allows affords, as well as the similarities of characteristics and skill sets that make veterans such ideal candidates for careers in the semiconductor industry. He describes some of the army programs that transition army veterans to civilian life. One of these programs is Soldier for Life.Major Ray Willson provides more details on Soldier for Life, which connects the army with government and non-government organizations to influence policies, programs, and services for soldiers veterans, and families. He explains the three pillars in detail.  Find our Guests on LinkedIn: Larry Smith, TEL U.S.General Paul Funk, U.S. ArmyMajor Ray Willson, U.S. ArmyTEL Tokyo Electron (TEL) provides innovative semiconductor and flat panel display production equipment. Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
In this episode, Françoise von Trapp interviews Laura Matz, CEO of Athinia™ and Chief Science and Technology Officer of Merck KGaA, Darmstadt, Germany, about the growing need for data collaboration between materials suppliers and semiconductor device manufacturers, and the solution she helped create. Over the past 10 years, more new materials have been introduced into semiconductor manufacturing at each device node. At the same time, processes continue to tighten. This is increasing sensitivities to materials variations. Because of this, materials companies have to publicly communicate on excursions in the materials supply chain. Until now.  Matz explains how a secure data ecosystem platform can use Big Data and AI to solve these issues. She provides details on how this platform addresses both IP security and cybersecurity. The platform she describes, Athinia™, was launched in December 2021. This secure data collaboration platform allows semiconductor device manufacturers and materials suppliers to share, aggregate, and analyze data to unlock efficiencies and time to market while improving quality, supply chain, and sustainability.   Six months in, Matz has some exciting news to share about a collaboration with Micron. She also talks about her role in conceptualizing this platform and bringing it to life.  Athinia - Data for Pioneers Building a secure data ecosystem to solve some of the toughest semiconductor industry problems.Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
The secondary semiconductor equipment market has been under a strain as secondary tools have been in hot demand since the chip shortage began in 2020 impacting the entire semiconductor supply chain. Here to speak with Françoise about this are Bruce Kim and Jin Choi of SurplusGLOBAL. They are their company’s perspective, and the actions they are taking to address the situation.   Kim talks about the growth of the secondary equipment market in Korea, where the company is based. He explains that the chip shortage has not only placed a demand on new tools but secondary tools because of the need to increase the capacity of legacy node chips. He talks about challenges facing companies who want to expand capacity. The main issue is the long lead times for new tools, so customers are turning to secondary equipment. There are also challenges with finding parts for legacy tools.  To address these challenges, SurplusGLOBAL established its Semiconductor Equipment Cluster. Kim discusses the motivation for building it. He also talks about the company’s new global parts program to support customers around the world who struggle to find replacement parts for otherwise perfectly good tools that have years of life left in them.   Lastly, to support customers who need to optimize new processes but don’t have the spare lines to devote to them, they’ve launched an R&D Foundry program. Jin Choi leads this initiative and discusses it.  Kim wraps up our discussion by talking about the role secondary semiconductor equipment can play in creating a more sustainable semiconductor ecosystem. To learn more about SurplusGLOBAL visit the website. or contact Bruce Kim, CEO, SurplusGLOBAL on LinkedIn.  SurplusGLOBAL SurplusGLOBAL is one of the largest one-stop platforms for pre-owned semiconductor equipment. Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
In this episode, we visit 3D InCites member companies on the trade show floor at SEMICON West and the Design Automation Conference to learn about what they are showcasing this year. Dave Kirsch and Paul Lindner of EV Group talk about the latest achievement in die-to-wafer fusion and hybrid bonding, and what it means for multi-die system-on-chip.  They also share BIG news about 3D ICs.  Alan Weber, Cimetrix, a division of PDF Solutions, talked about the company’s connectivity and control products for automated fabs and the data pipeline its technology enables. Weber emphasized the use of streaming data to improve supply chain challenges.  Faraz Shoukat of Anemoi Software walks us through a demonstration if the company’s cloud-based thermal modeling tool for multichip modules, stacked die, and chiplet integration.  Monita Pau of Onto Innovation talks about the importance of particle inspection for hybrid bonding, and the focus on panel-level packaging. Byron Exarcos, CEO ClassOne Technology, talks about the company’s plating and surface preparation process capabilities to support hybrid bonding, especially for microLED applications. The company introduced a new Solstice platform at the show and Exarcos reports that the company is already gaining traction.  Meg Conkling, of Veeco, joins the podcast for the third time – and she and Françoise compare notes about the markets since SEMICON West 2021. They discuss the automotive industry, and their next vehicles. They also talk about advances is Veeco’s Laser Spike Annealing, lithography, and ion beam deposition product offerings.  Jim Garstka, PlasmaTherm, talks about the impact of the chip shortage, the company’s latest product introduction, the HeatPulse, used in automotive electronics, as well as the role plasma dicing takes in providing clean die surfaces for die-to-wafer hybrid bonding.  Vidya Vijay, CyberOptics, talks about the latest generation WaferSense technology used for wafer and reticle calibration for front-end tools. She also talked about some of the presentations she attended at SEMICON West, and what she’s excited about.  Alex Chow, and Sai Danraj of YES about the company’s recent shift in focus from wafer segments for backend processes to the IC carrier substrate segments of the industry. The products they showcased included the next generation Vertacure, as well as two new products that will be introduced on the market in the coming year: one is for solder reflow, and the other for glass panel substrates. Kiterocket A global strategic marketing agency serving the semiconductor and sustainability industries.SEMI A global association, SEMI represents the entire electronics manufacturing and design supply chain. Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
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