A Conversation About Reshoring Advanced Packaging in the U.S.
The acronyms involving funding for semiconductor manufacturing are flying around Washington. There is the Chips for America Act, focused on re-shoring, The Facilitating American-Built Semiconductors (FABS) Act that promises tax credits for investments in, either equipment or fabs. and then there’s the $250 billion US Innovation and Competition Act, which earmarks $52bn for new chip manufacturing and research. This is now being debated in the House of Representatives. There’s a lot to unpack here – what we’re focusing on today is how all of this could impact advanced packaging and test in the US – To talk about this, we invited 3D InCites Community Members. Bob Patti, of Nhanced Semiconductor, Alan Huffman, of Micross Components, and Dick Otte, of QP Technologies.
The conversation covers a wide range of questions: Will the $52Bn be enough? How should those funds be best allocated? What will the impact be on small entities? Where will the workforce to support it come from? How do we create a US supply chain? Are we politicizing chip manufacturing? How do we ensure that Foundry 2.0 adds IP value and attracts new talent? Is the answer a vertically integrated advanced packaging company? Should we create a consortium of advanced packaging companies and use the government funding to fill in the gaps?
Tune in to hear the answers to these questions and much more.
If you'd like to learn more about some of these 3D InCites Community Members, visit their profiles:
You can also contact the guest directly via email:
Bob Patti, Nhanced Semiconductor
Allan Huffman, Micross
Dick Otte, QP Technologies