Episode 21: U.S. Tightens Export Net, Siemens–TSMC 3D IC Push & China’s Trade Counterpunch
Update: 2025-10-07
Description
This week in Chips Weekly by Diana :
- 🇺🇸 The U.S. expands its export blacklist with a new “50% rule,” instantly pulling hundreds of China-linked subsidiaries into restrictions.
- 🤝 Siemens & TSMC team up on advanced 3D IC and AI design, reshaping the future of multi-die chips and packaging.
- 🇨🇳 China fires back with anti-dumping probes and fresh import controls aimed at U.S. semiconductor suppliers.
- 🔍 Industry Spotlight: The battle over chiplet standards — why whoever controls the rules for modular chips will control the future of compute.
- 💡 Chip of the Week: TSMC’s SoIC-X 3D packaging platform powering the next generation of AI and HPC.
🎧 Listen for a sharp, global view of the chip industry — subscribe and never miss a week.
#ChipsWeekly #Semiconductors #TSMC #ExportControls #Siemens #ChinaChips #SoICX
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