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On the Line with… Brought to you by I-Connect007. This exciting, new podcast features the latest and future trends having market impact in the electronics industry from the voices of experts.
46 Episodes
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Solder joint reliability is essential to product performance and longevity in electronics. Failures can lead to costly repairs, dissatisfied customers, or even catastrophic loss, depending on the application. In this Voices of the Industry episode, Marcy LaRont talks with Shantanu Joshi of KOKI America about how advanced materials—such as crack-free fluxes and zero-flux-residue solder pastes—are helping address challenges like voiding, heat dissipation, and reliability in demanding environments.
Nolan Johnson and ASC's John Johnson explore the implications of UHDI on via from a designer's perspective. The metallurgy, chemistry, mechanics, and stackup reduction mean that designers have fewer constraints with UHDI.
John Johnson continues this series, outlining UHDI's contributions to reduced SWaP—size, weight and power—considerations.
American Standard Circuits' John Johnson details how the new capabilities in UHDI can fundamentally change what it means to design for manufacturability.
To launch this series, ASC's John Johnson introduces us to ultra-high-density interconnect. Johnson sets the agenda for further discussion by sharing practical reasons why UHDI could be key to your next design challenge, and why both designers and the manufacturing chain are excited by UHDI's potential.
In a thoughtful conclusion to the series, Kuldip Johal connects the key themes, examining market drivers, the technological implications of semiconductor advances, and strategies for aligning PCB production with evolving market demands.
John Johnson leads the way straight into UHDI's benefits to RF style design.
Patrick Brooks discusses the role of wet processes—in conjunction with laser systems—in delivering on the “Optimize the Interconnect” idea. One example is Bondfilm, a unique coating that allows CO2 lasers to more effectively ablate copper than ever before.
Laser via drilling is a critical process window for MKS's Optimize the Interconnect concepts. Casey Kruger joins the podcast to explain exactly how the CO2 laser technology has been harnessed to create more accurate vias, faster, and in a smaller, more energy-efficient footprint.
MKS' Atotech's Frank Bruening and Roger Massey join us to discuss the emerging complexities in achieving optimal interconnect, and the key role chemistry plays. Their examples of the interplay between laser drilling, the chemical makeup of the substrate layers, and the plating process are worth a listen.
We continue our conversation with Chris Ryder on the Optimize the Interconnect(SM) concept. Chris shares some specific examples and details how and why industry leaders are adopting the OTI approach.
OTI, or "optimize the interconnect," is a concept approach to producing higher quality, higher complexity PCB products. Chris Ryder, MKS Director of Business Development, introduces the concept and sets the stage for a more detailed discussion.
We continue our conversation with Ryan Miller, and we get practical about design and manufacturing techniques to manage thermal effects, including such structures as via farms, insulated metal substrates, coin technology, and copper pedestals.
Ryan Miller takes Nolan Johnson through strategies for managing heat that can be applied during the design planning and specification phases. Prevention means there is less to mitigate.
In this kickoff episode, Ryan Miller makes the case for why thermal management needs to be on the minds of the designers. But what are the main causes of excess heat in our designs today? Join us as we start by defining the problems, then turn to the array of solutions.
Because solder formulations have been enjoying rapid development in the low-temperature solder arena, co-author Pritha Choudhury, senior R&D scientist with MacDermid Alpha, joins Nolan Johnson to discuss the update to The Printed Circuit Assembler's Guide to Low- temperature Soldering. Topics covered include details on key performance traits in low-temperature solder, and Choudhury shares her recommended low-temperature soldering solution.
Beth Turner joins the podcast to discuss her book, The Printed Circuit Assembler's Guide to Encapsulating Sustainability for Electronics. The conversation ranges from the most common encapsulation materials used, to when and why to use them. Turner points out that encapsulation materials are also experiencing a creative time with respect to both performance and sustainability. A must-read for anyone with a role in specifying or applying encapsulation materials.
Martyn Gaudion spills the tea on his third book, sharing more secrets for successful high-speed design.
Scott Miller and Brian White join host Nolan Johnson to discuss Miller's book, The Printed Circuit Designer's Guide to Executing Complex PCBs. Miller and White add insight to the seven key disciplines required by designers to successfully design complex PCBs. Of course, in this fast-moving industry, they also provide updated perspectives.
In this episode, my guests are Julie Cliche-Dubois, product manager at Cogiscan, and Andres Luna, general manager at Univertools. Univertools represents Cogiscan in Mexico. Julie is the author of the recently published book, "The Printed Circuit Assembler's Guide to Factory Analytics.” In this episode, we're discussing the evolving role of data analytics, with an eye toward how analytics is driving meaningful action throughout the electronics manufacturing industry in Mexico and the rest of the Americas.
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