Meet the Author: Encapsulating Sustainability for Electronics author (MacDermid Alpha)

Update: 2025-07-23

Description

Beth Turner joins the podcast to discuss her book, The Printed Circuit Assembler's Guide to Encapsulating Sustainability for Electronics. The conversation ranges from the most common encapsulation materials used, to when and why to use them. Turner points out that encapsulation materials are also experiencing a creative time with respect to both performance and sustainability. A must-read for anyone with a role in specifying or applying encapsulation materials.

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In Channel

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Ultra HDI: SWaP Considerations

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How does Ultra HDI benefit: Routing Capabilities

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Ultra HDI - What does it mean to people, why would they want it?

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Optimize the Interconnect: Wrapping Up OTI

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How Ultra HDI Benefits RF Performance

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Optimize the Interconnect: MKS' ESI's role in OTI

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Optimize the Interconnect: OTI —Why it Matters

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Optimize the Interconnect: OTI—What is OTI?

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PCB Thermal Management - Solutions for Thermal Management – Part 2

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PCB Thermal Management - Solutions for Thermal Management – Part 1

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PCB Thermal Management - Heat in the PCBs

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Meet the Co-Author of Low-temperature Soldering, Volume 2

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Meet the Author: Encapsulating Sustainability for Electronics author (MacDermid Alpha)

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Meet the Author: Secrets of High-Speed PCB Design From Concept to Production

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Meet the Author: Succeeding at Complex PCB Design Through Methodology

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Meet the Author: The Rapidly Evolving Role of Data in North American EMS

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Meet the Author: Encapsulating Sustainability for Electronics author (MacDermid Alpha)

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Meet the Author: Encapsulating Sustainability for Electronics author (MacDermid Alpha)

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Meet the Author: Encapsulating Sustainability for Electronics author (MacDermid Alpha)