3D InCites Podcast

We are just about 5 weeks away from the biggest event of the year for the semiconductor industry – SEMICON West, which takes place July 11-13 at the Moscone Center in San Francisco. This annual event is the flagship of SEMI. The days are packed with conference sessions, the show floor showcases the latest and greatest technologies, the special pavilions are humming with activity, and the networking receptions and satellite parties offer great opportunities for networking. In this episode, Françoise talks with Joe Stockunas, President of SEMI Americas, about some significant and exciting changes happening this year, such as the CEO Summit, which focuses on the path to $1T, the path to Net Zero, and the path for talent. He talks about the 20 under 30 program, recognizing significant contributions by semiconductor technologists who are under 30 years of age. There will be a SemiSisters reception, co-hosted by 3D InCites and sponsored by Edwards, celebrating the women who work in the semiconductor industry. To enhance the attendee exposition experience, new dining options were added that feature local San Francisco fare. We also get a sneak peek at more changes coming in 2025.  Learn more and register at the SEMICON West website.  Connect with Joe Stockunas on LinkedIN. SEMI A global association, SEMI represents the entire electronics manufacturing and design supply chain. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showLike what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

 Continuing our focus on sustainable semiconductor manufacturing, in this episode Françoise speaks with Cédric Rolin, project manager at imec, about its Sustainable Semiconductor Technologies & Systems (SSTS) research program. Launched by imec in 2021, the SSTS rallies stakeholders from across the semiconductor industry to help reduce the ecological impact of the IC value chain.  In response to mounting concerns about climate change, tech companies around the world are accelerating efforts to complete carbon neutrality for their supply chains and products. The semiconductor industry recognizes its pivotal role in this endeavor. Studies show that almost 75 percent of mobile devices’ CO2 emissions can be traced back to the underlying manufacturing process – with chip production being responsible for nearly half of that footprint. Against this backdrop, the SSTS program provides detailed information on the environmental impact of choices made during semiconductor technology's definition phase.  To date, SSTS has 15 member partners including Google, Amazon, Apple, Meta, and Microsoft; GlobalFoundries, TSMC, Samsung, and Rapidus; and equipment suppliers including Applied Materials, ASML, Edwards, Kurita, SCREEN, and Tokyo Electron. In this podcast, you’ll learn the back story of the program, how it's structured, what role these companies play, how they developed a new data tool called imec.netzero, how the program will help companies achieve Net Zero Emissions, and more.   imec will be discussing this important topic further at its ITF Semicon USA, in a fireside chat with imec’s  Emily Gallagher and SEMI’s Mousumi Bhat.  Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In this fourth episode of the SEMI MIT podcast series, you’ll learn about the semiconductor device design market, the latest SEMI Electronic Design Market Data (EDMD) report, and the Electronic System Design Alliance (ESDA) whose members contribute to it. Speakers include: ·       Paul Cohen, Senior Program Manager of ESDA·       Bob Smith, Executive Director of ESDA·       David Ghodsizadeh, Director of Product Marketing for the SEMI Market Intelligence TeamThe group discusses the report itself – what it covers and how data is gathered. You’ll learn about how the report is used by customers, and the benefits of participating in it.  You’ll also get an inside look at the report itself, and what it shows about the state of the design market. Additionally, you’ll learn about the upcoming ESDA CEO Outlook Membership meeting, on May 18, 2023, and reasons why you should attend. Resources·       Learn more about the ESDA·       Learn more about the EDMD Report and read the press release·       Purchase an EDMD Single Report·      Subscribe to the EDMD Report·       Register for the CEO Outlook ·       Download the EDMD Q4 newsletter  In the first three episodes featuring SEMI's Market Intelligence Team, you get an overview of the market data portfolio, and specific reports for the semiconductor manufacturing equipment market, the World Fab Forecast, and the Semiconductor Manufacturing Monitor, respectively.  Find them here. Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In the first two episodes of this series, we heard from startup finalists who participated in last year’s program about their sustainability solutions, their experience with the program – including making strong industry connections and some securing funding, and advice for startups participating this year.  In this third and final episode of the SEMI Startups for Semiconductor Sustainability series, you’ll hear about the journey ahead for the semifinalists of this year’s Startups for Semiconductor Sustainability program.  SEMI just announced the semifinalists for this year’s program. You can read about it here. You’ll also hear from two of the VCs who make this program tick. They explain how they came up with the concept for a start-up pitch event, and how they collaborated with SEMI and VCs across the supply chain to make it happen. You’ll hear about the process and the benefits of participating in this event. As an attendee of SEMICON West, you’ll find out how to take in the program and learn about the sustainable solutions of this year’s startups. Contact The Panelists·       James Amano, Senior Director, EHS & Sustainability at SEMI·       Jennifer Ard, Managing Director and Head of Investment Operations at Intel Capital·       Dr. John Wei, Investment Director at Applied Ventures LLCSEMI A global association, SEMI represents the entire electronics manufacturing and design supply chain. Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In this episode, recorded at IMAPS DPC 2023, Françoise von Trapp talks with Indium’s Andy Mackie, about his latest mission to address the confusing and complex lexicon of Advanced Packaging technology.  He shares the backstory on the idea, he has come up with to change the way we talk about semiconductor device packaging, that will uplevel the importance of what is really interconnect technology. Mackie’s position, and that of other colleagues in the industry, is that the term "packaging", when applied to semiconductor assembly, is misunderstood by most people, at a time when its importance (in the wake of the CHIPS Act and similar legislation) is growing.As we enter 2023, Mackie suggests that it’s time to make this simple so laypersons and experts alike can use the same terminology. The ensuing discussion digs into a light-hearted debate about his “strawman” ideas to put some standardization around the nomenclature known as advanced packaging.  If you would like to support this effort, please contact Andy Mackie on LinkedIn.   IMAPS International IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In this special episode of the 3D InCites Podcast, we bring you, in its entirety, a panel discussion that took place earlier this year at SEMI ISS Europe. The theme: Closing the Talent Gap and Cultivating the Workforce of Tomorrow. The multigenerational panel offers different perspectives and multiple topics, such as what they look for in a company, the importance of workplace culture, and what the semiconductor industry needs to do to improve its image to recruit more people. We join the panel in progress, as Cassandra Melvin opens the questioning. Some of the questions posed include: ·      How would you describe the image of the semiconductor industry? ·      Is there a specific challenge for the EU to improve the image of the industry?·      How can Internships and apprenticeships can be improved to make the industry more compelling to candidates? ·      How do the generations differ in what makes a good workplace?  Moderator: Cassandra Melvin, Senior Director of Business Development & Operations, SEMI Europe·      Isabella Drolz, VP Product Marketing Comet Yxlon·      Anna McEvoy, Project Team Lead Semiconductor Service, Edwards·      Léo Saint-Martin, DECISION Etudes & Conseil, METIS Project·      Clara Haubenwallner, Student Assistant, Graz University of TechnologySEMI A global association, SEMI represents the entire electronics manufacturing and design supply chain. Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

At IMAPS DPC, Françoise von Trapp moderated a town hall discussion, DEI: It Takes a Village. The target audience was not HR or hiring managers, but the regular attendees who may be wondering what they can do to help create an atmosphere of equity and inclusion at their workplace. We asked the hard questions that people might be asking: Why should I care? Why do I need to use my pronouns? What can I do/say to have an impact on our company culture?  Panelists: Francesca Domingo, EMD Group | Head of University Relations & Talent Strategy, EMD Group Ann McKenna, Arizona State University, Fulton Schools of Engineering | Vice Dean for Strategic AdvancementRebeca Obregon-Jimenez, Avnet | SVP Strategic Business Engagements & Supplier ManagementRobin Stubenhofer, Kansas City National Security Campus (KCNSC) managed by Honeywell | VP of EngineeringIMAPS Device Packaging Conference Interconnects for Tomorrow’s Applications Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In this episode, Françoise von Trapp holds impromptu interviews with 3D InCites members who attended, exhibited, and/or presented at the 2023 IMAPS DPC in March.  Topics of discussion include: Using AI in microelectronics manufacturing, how front-end processes are finding their way into the back-end, updates on glass substrates, capillary underfill advancements, dealing with wafer warpage,  and advanced substrates and standards on panel sizes.    Contact our GuestsKeith Felton, Siemens EDA, summarizes the presentation he gave on how to put AI, Machine Learning, and Deep learning to work in the semiconductor manufacturing environment. Emerald Greig, PTW Group,  explains PTW Group’s mission to become the go-to company for legacy support.  Emerald’s daughter recently appeared in the latest episode of Roadtrip Nation, Chip In, in which three young people searching for careers explore the works of microelectronics. Jim Straus of ACM Research shares feedback from the IMAPS attendee perspective. It was his first time at the event, and he shared some of his takeaways from the sessions he attended, particularly in the area of glass substrates. Ken Araujo of Namics talks about advancements in liquid capillary underfill, driven by cost as well as tightening specifications of advanced packaging applications.  Debbie Claire-Sanchez, of ERS Electronic GmbH talks about the company’s ongoing research to address wafer warpage issues.  Keith Best, Onto Innovation, talks about the ongoing debate over advanced IC substrates and standardization on panel size. IMAPS Device Packaging Conference Interconnects for Tomorrow’s Applications Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

This episode features interviews that were recorded live at IMAPS DPC 2023.   First is an interview with CEA Leti’s Silvie Joly, who gave an industry coalition talk during the Global Business Council session, New Momentum in Semiconductors: Impact of Ecosystems, a European Case Study. Joly is the partnerships manager for 3D integration and packaging at CEA Leti. She provides key takeaways from her talk. Next up is Basam Ziadah, who presented his keynote, Driving Adoption of Advanced IC Packaging in Automotive Applications. He talks about what drives more semiconductor devices in automotive applications. He describes the challenges we need to address to deliver advanced technology with the level of reliability required by the automotive industry, and how chiplet integration can be used.  Lastly, Françoise interviews Nicholas Harris, CEO of Lightmatter, who presented on extending Moore’s Law with photonics packaging. He explains why chiplets aren’t the panacea everyone thinks, of and how 3D integration using photonics packaging is the way forward to achieve performance at low power for artificial intelligence and high-performance computing.Episode Guests·      Sylvie Joly, CEA-Leti·      Basam Ziadeh, General Motors·      Nicholas Harris, LightmatterIMAPS Device Packaging Conference Interconnects for Tomorrow’s Applications Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

At the 2023 IMAPS Device Packaging Conference, there were a lot of discussions about chiplet technology, both in panel discussions and in general conversations. In this episode, we pulled together several interviews in an attempt to demystify and define chiplets, how they are produced and interconnected, what challenges the industry faces, and what we need to do to overcome them.  You’ll hear from:  Keith Felton, Siemens EDA Chris Scanlan, BesiChoon Lee, JCET Group IMAPS International IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In This episode, Françoise von Trapp interviews some of the 2023 3D InCites Award Winners, to learn about the significant accomplishments they are being recognized for.   First is James Bear, TEL, who describes some of the company’s best practices that helped them secure the 2023 3D InCites Sustainability Award. Engineer of the Year, Markus Leitgeb, AT&S, explains the concepts and advantages of the company’s Embedded Component Process (ECP), which he helped develop. Mark Gerber, ASE, winner of the Device Technology of the Year award for the VIPack™ Platform explains this six-pillar approach and the recent announcement of its fan-out package on package (FOPOP) technology. Eelco Bergman, of Saras Micro Devices, this year’s Start-up of the Year Award Winner, talks about the company’s team of industry experts, and the technology its developing heterogeneous integration technologies that will improve power efficiency for AI, high-performance computing, and data centers.  Thomas Uhrmann and Garrett Oakes of EV Group talk about the company’s breakthrough NanoCleave process that one the 3D InCites Process of the Year Award. This revolutionary IR laser process targets silicon carrier technology for 3D integration. Tim Olson and Robin Davis of Deca, winner of the SemiSister Award for DEI, talked about building DEI into Deca’s DNA, and what it’s like to establish a culture of DEI at a small company. Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In this second episode of the SEMI’s Start-ups for Sustainability podcast series, SEMI’s James Amano returns to provide a quick recap of the program as SEMI gears up for its Startups for Semiconductor Sustainability Pitch Event Year 2. This year’s focus is on start-up companies that provide solutions that address the challenges of semiconductor manufacturing emissions, energy issues, and circularity (water and waste.) In this episode, we meet three finalists from the 2022 pitch event who share their success stories and provide some useful tips for navigating this year’s pitch event. You’ll hear how Membrion’s ion exchange membranes us desalinization techniques to recycle manufacturing wastewater to reuse both the water and the reclaimed minerals like copper. You’ll learn how NuMat Technologies programs chemistries to handle and purify gasses to help semiconductor manufacturers reach their sustainability goals. And you’ll learn how Purity ReSources helps semiconductor manufacturers move from a linear to circular closed-loop process to recycle millions of gallons of solvent used in photoresist processes every day. Lastly, the panelists will share their experiences at the pitch event, and how it helped propel their companies forward.  Panelists·       James Amano, EHS & Sustainability,  SEMI·       Greg Newbloom, CEO & Co-Founder at Membrion·       Ben Hernandez, Founder & CEO at NuMat Technologies·       Daniel Alvarez, Founder & CEO at Purity ReSourceSEMI Sustainability Initiative The SEMI Sustainability Initiative brings together companies across the global electronics manufacturing and design supply chain to collaborate on the industry’s toughest sustainability challenges. One program in the initiative is SEMI Startups for Semiconductor Sustainability, which offers companies with innovative sustainability solutions the opportunity to present to top semiconductor VCs. Submit your startup’s application today.  Applications are open until March 20, 2023.  Learn more at SEMI.org/startups.  SEMI A global association, SEMI represents the entire electronics manufacturing and design supply chain. Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

These days, everyone is talking about the importance of sustainability. In the semiconductor industry, developing more sustainable practices is top of mind for most manufacturers, because they are challenged with meeting increasing demands as semiconductors have become critical to everyday life, yet manufacturing them puts a strain on natural resources. To address this, The SEMI organization put together a sustainability initiative – and one element of that is its Startups for Sustainability program. This episode is the first in a series of three, in which we’ll learn more about the program, and talk to some of last year’s finalists.   Panelists·       James Amano, Senior Director, EHS and Sustainability, SEMI·       Jon Herlocker, President & CEO at Tignis·       Maher Damak, CEO & Co-Founder at Infinite Cooling·       Lester D'Cruz, Senior Director Product Management at ATONARPSEMI Sustainability Initiative The SEMI Sustainability Initiative brings together companies across the global electronics manufacturing and design supply chain to collaborate on the industry’s toughest sustainability challenges. One program in the initiative is SEMI Startups for Semiconductor Sustainability, which offers companies with innovative sustainability solutions the opportunity to present to top semiconductor VCs. Submit your startup’s application today.) Learn more at SEMI.org/startups. SEMI A global association, SEMI represents the entire electronics manufacturing and design supply chain. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showLike what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

Welcome to 3D InCites In Case You Missed It Series. We did a lot of podcasting in 2022. Some of our longer episodes consisted of multiple interviews, so you may have missed some of the juiciest conversations. So when there’s a break in the action, we’re taking you back to those conversations.In this episode, we’re going back to ECTC 2023, where Françoise sits down with ASE Fellow, Bill Chen, who has been instrumental in progressing the Heterogeneous Integration Roadmap. He talks about its purpose, the committee’s vision, and how it will make possible the next 50 years of Moore’s Law, as Gordon Moore himself envisioned in the second part of his paper. Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

For first episode of 2023, Françoise von Trapp handed over the microphone to Dean Freeman, the market analyst at 3D InCites. He attended SEMI’s Industry Strategy Symposium at Half Moon Bay, CA, in January and interviewed SEMI’s Market Intelligence team for the third episode in this four-part series. Part 3 focuses on the Semiconductor Manufacturing Monitor, a report jointly developed by SEMI and TechInsights. SEMI ISS is an annual event attended by semiconductor industry executives who rely on it for updates on many crucial aspects of semiconductor industry operations. As such, Dean and the panelists discuss some of the key market intelligence takeaways from this ISS 2022 before delving into the report. Panelists include:·       Inna Skvortsova, Market Research Analyst in the SEMI Market Intelligence Team·       Risto Puhaka, Director of Market Research, Market Research TechInsights ·       David Ghodsizadeh, Director of Product Marketing for the SEMI Market Intelligence TeamLearn more about SEMI's Market Intelligence TeamLearn more about the Semiconductor Manufacturing Monitor Order a sample of the Semiconductor Manufacturing MonitorSEMI A global association, SEMI represents the entire electronics manufacturing and design supply chain. Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

This episode was recorded live during the Advanced Packaging Sympoisium at SEMICON Europa on November 16. 2022. Steffen Kröhnert, President & Founder, ESPAT-Consulting, moderates a panel discussion with members of the semiconductor packaging service provider community in Europe. The topic? The Future of semiconductor manufacturing in Europe – and specifically, back-end packaging and test. Kröhnert sets the stage by providing an overview of the current availability of semiconductor packaging in Europe. Panelists Oliver Maiwald, CEO, Sencio B.V. and Jan de Koning Gans, Managing Director, RoodMicrotec GmbH, talk about their respective offerings, and discuss the desire to build a robust packaging ecosystem to support the European semiconductor supply chain. Q&A with audience wraps up the conversation.  Contact the Panel on LinkedIn:Steffen Kröhnert, President & Founder, ESPAT-Consulting   Oliver Maiwald, CEO, Sencio B.V.Jan de Koning Gans, Managing Director, RoodMicrotec GmbH            Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In this episode recorded live at SEMICON Europa 2022, Françoise hands over the mike to Cassandra Melvin, Senior Director of Business Development and Operations at SEMI Europe. At SEMICON Europa, Cassandra led a panel discussion on the topic of Leveraging Generational Differences in the Shifting Workplace. The panel comprised industry professionals representing different generational cohorts, from Baby Boomers to Gen-Z. We recorded it in its entirety. Meet the Panellists   Cassandra Melvin, Moderator, SEMI EuropeFrancoise Chombar, Chairwoman, MelexisPhilip Matthes, Head of Global Human Resources, Semiconductor Materials, Merck KGaA, Darmstadt GermanyMark Agujar, Project Technician, Edwards Vacuum Marco Fasel, Industrialization Team Leader, Comet PCTLike what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In this episode, recorded live at SEMICON Europa in Munich the week of November 14-18, 2022, Françoise von Trapp speaks with 3D InCites member companies that either exhibited, presented, or in some cases, both, at the event. Conversations range from discussions about this year's event compared with the 2021 show, the impact of the respective EU and US CHIPS and Acts on their businesses, and the technology innovations they showcased at the show.  Guests and CompaniesPeter Dijkstra of Trymax  Alan Weber of Cimetrix by PDF Solutions  Dieter Rathei and Krista Tropper of D.R. YieldThomas Fries of FormFactorHeiko Dudek of Siemens EDA and Raphael Theveniau of ST Microelectronics Jim Garstka of PlasmaTherm Byron Exarcos and John Voltz of ClassOne Technology Ralph Zoberbier of Evatec  Debbie Claire Sanchez and Sophia Oldeide of ERS electronic GmbH Jim Straus and  Sally-Ann Henry of ACM ResearchRam Trichur of  Henkel Corporation  Mike Rosa of Onto Innovation  FInd these Articles on 3D InCitesThe Road Towards Climate Neutrality from the Perspective of a German SME Mobile Antennas and Power Devices that Break The Mold Support the showLike what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

This podcast episode was recorded live at SEMICON Europa 2022, in Munich Germany. It features interviews with select keynote speakers representing the depth and breadth of topics discussed throughout the week. Luc Van den hove, President and CEO of imec, in Belgium talks about the rollercoaster ride we’ve been on in the aftermath of the pandemic, the war in Ukraine, the subsequent energy crisis, and financial crisis, and how this has propelled semiconductors into the limelight. He also explained how semiconductors enabled the ability to generate and analyze gigabytes of data using AI to quickly sequence the human genome, and how that made it possible to develop a COVID vaccine in just one year, as well as other examples of how semiconductors are helping to drive change in global challenges like the climate crisis, health, and food supplies.  Laura Matz, CEO of Athinia, returns to the podcast to talk about the importance of developing a data ecosystem to bring materials suppliers and device manufacturers together to collaborate. Since then, she’s been exploring other areas of semiconductor manufacturing, such as supply chain and sustainability.Michelle Williams-Vaden, of SEMI Foundation, spoke about the talk she gave during the Future of Work session on how companies can shift to welcome a more inclusive workforce. She provides some strategies on how to attract new talent and create a devoted team. Isabella Drolz, of Comet Yxlon, talks about how X-ray technology is the future of inspection in advanced packaging. She explains why there hasn’t been an industry-wide adoption of X-ray inspection as the preferred method. Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In this episode, Françoise speaks with Beth Keser, Ph.D., about her latest book co-authored with Steffen Kröhnert, ESPAT Consulting.  Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces was published in December 2021. It is essentially a companion to the wafer-level packaging handbook titled, Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies, which the duo published in 2019. This book picks up where the first one left off, with 11 new chapters including contributions from some of the same companies that participated before, as well as new ones.  The book examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges, and is filled with contributions from some of the field’s leading experts.In the interview, Beth talks about the book’s backstory, why and how it was written, and who participated. She also explains why they decided to begin the book with a market report, and how the book is a snapshot in time. Contact Beth Keser on LinkedInOrder your own copy of Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces.Like what you hear? Follow us on LinkedIn and Twitter Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.