3D InCites Member Spotlight: Why the Front End Needs the Back End To Win in AI
Description
We recorded live at IMAPS with Siemens, ACM Research, Shellback Semiconductor, DECA, Nordson Electronic Solutions, and VIEW Micro Metrology to explore how AI demand, chiplets, and panels are reshaping advanced packaging. We dig into 3D BLOX, thermal and test roadblocks, green chemistries, metrology at scale, and why the back end now leads innovation. Listen to learn about:
• The Siemens–ASE collaboration on 3D BLOX models and VIPACK workflows
• Interoperable YAML-based packaging definitions moving toward IEEE standard
• 3D stacking to cut picojoules per bit amid thermal and test limits
• Panel-level packaging economics, sizes, and lack of standards
• ACM Research updates in copper plating, bevel clean, frame clean, and compound deplating
• Batch spray versus single wafer trade-offs at Shellback Semiconductor
• HydrOzone green strip replacing legacy NMP in select flows
•The DECA–SST deal for NVM chiplet package and SoC disaggregation
• Nordson Electronic Solutions' panel strategy, IntelliJet 1.1, Vantage platform, and warpage control
• VIEW Micro Metrology's high-throughput telecentric metrology across wafers and large panels
Learn more at imaps.org
United States
