Claim Ownership3D InCites Podcast
Subscribed: 12Played: 119
Subscribe
© 2025 3D InCites, LLC
Description
As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.The 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.
183 Episodes
Reverse
Want a candid look at how women build durable careers in one of the world’s toughest industries? We sit down with three semiconductor leaders - Nitza Basoco, Anne Meixner and Julia Freer - who share how early encouragement, gritty problem solving, and clear communication turned curiosity into impact. From summer jobs at national labs and early days at IBM to leading operations, test, and sustainability initiatives, their stories show why diverse voices aren’t just nice to have—they’re a compe...
Power electronics are quietly rewriting the rules of energy use—from the range of your EV to the efficiency of a hyperscale data center. Françoise sits down with Henkel’s Ram Trichur to unpack what’s driving the $67.5B surge in power semiconductors and why the move to wide bandgap materials like silicon carbide and gallium nitride is such a big deal. We break down the real differences between logic and power devices, then dive into where innovation is happening right now: die attach ma...
The floor in Phoenix was packed, and so were the ideas. We sat down with innovators across the stack—equipment makers, metrology experts, logistics strategists, and software leaders—to map the real state of advanced packaging and what it takes to build, measure, move, and power tomorrow’s chips. EV Group kicked things off with a candid look at die-to-wafer realities: activation on film frame, then 100% overlay metrology that measures tens of thousands of points per hour so every die and corn...
A nationwide talent engine for chips is taking shape—and it’s built to scale. Recorded live at SEMICON West in Phoenix, we sit down with SEMI Foundation leaders to unpack the National Network for Microelectronics Education, a hub-and-node model designed to align schools, employers, and workforce systems. Backed by CHIPS Act funding through the National Science Foundation, NNME will fund multi-state regional nodes that modernize curricula, streamline upskilling, and share proven playbooks acro...
We recorded live at IMAPS with Siemens, ACM Research, Shellback Semiconductor, DECA, Nordson Electronic Solutions, and VIEW Micro Metrology to explore how AI demand, chiplets, and panels are reshaping advanced packaging. We dig into 3D BLOX, thermal and test roadblocks, green chemistries, metrology at scale, and why the back end now leads innovation. Listen to learn about: • The Siemens–ASE collaboration on 3D BLOX models and VIPACK workflows • Interoperable YAML-based packaging definitions ...
We record live at IMAPS to follow a first-time attendee’s leap into advanced packaging and a trio of high school students discovering semiconductors, robotics, and career paths that bridge disciplines. Along the way, we unpack speed-to-market, standards, hybrid vs TCB, and why AI skills matter. • why a self-funded first conference can reset a career • key takeaways from PDCs and technical talks • time-to-market pressure across packaging workflows • standards tension between front-end and pac...
We sit down with Dr. Subu Iyer of UCLA to unpack chiplets vs dielets, why a universal ecosystem is missing, and how sub‑10 µm bump pitch could make protocols optional. Then we host a panel featuring John Knickerbocker, IBM; Mike Kelly, Amkor; and Tolga Tekin, Fraunhofer IZM on co‑packaged optics, bandwidth, and power for AI data centers. • chiplet as design construct, dielet as physical die • lack of universal chiplet ecosystem and interoperability • bump pitch scaling and protocol overhead ...
A semiconductor wafer travels around the globe five times on average before becoming the chip in your smartphone. Each journey represents a potential risk to device reliability that few consumers—or even industry professionals—ever consider. Behind every high-performing semiconductor device lies a carefully orchestrated logistics operation ensuring these sensitive components arrive intact and functioning. As Francoise von Trapp discovers in this eye-opening conversation with John Desmond and...
SEMI's flagship event, SEMICON West, is moving to Phoenix, Arizona this October 7-9, 2025, after 35 years in San Francisco, coinciding with the region's semiconductor manufacturing boom and $200 billion in announced investments. In this episode, Françoise speaks with SEMI Americas president, Joe Stockunas, who shares reasons for the move and what attendees can expect to experience. This includes: • Move driven by need to refresh the event and bring it closer to industry growth • New Oc...
The IMAPS International Symposium returns to the Town & Country Resort in San Diego from September 29-October 2, 2024, featuring restructured technical tracks, new Monday panel discussions, and exciting networking events including a special reception aboard the USS Midway aircraft carrier. General Chair Benson Chan and outgoing IMAPS President Erica Folk share what attendees can expect at this premier microelectronics packaging event. • Expanded program with six focused technical tracks ...
X-ray technology reveals what the naked eye cannot see - the intricate world of semiconductor interconnects that power our digital lives. In this deep dive with Ben Peecock, Senior Director of Business Development at Nordson Test and Inspection, we uncover the critical differences between x-ray inspection and metrology that keep semiconductor manufacturing on track. With nearly three decades of experience in the industry, Peecock guides us through the evolution of semiconductor inspection te...
Thailand is positioning itself as a new hotspot for semiconductor and microelectronics manufacturing, building on existing infrastructure and establishing key partnerships throughout the region. Managing editor Jillian McNichol shares insights from her recent trip to Thailand where she toured facilities and interviewed industry leaders about the country's ambitious plans. • Thailand has been involved in assembly and test operations since 1996 through the Thai Microelectronics Center • Curren...
The race toward more powerful AI carries a hidden cost that's becoming impossible to ignore: skyrocketing energy consumption. Did you know AI is projected to devour 10% of global electricity by 2030? This staggering figure has even forced tech giants to delay their sustainability goals. Enter ASE's Executive Vice President Yin Chang, who reveals how the world's largest semiconductor packaging company is tackling this challenge head-on. The solution lies in revolutionary approaches to power d...
The 75th anniversary celebration of ECTC in Dallas showcases a remarkable evolution in advanced packaging technologies, revealing how semiconductor priorities have dramatically shifted. Rather than the relentless miniaturization of the smartphone era, today's AI-driven applications demand larger packages with more functionality and sophisticated thermal management solutions. Glass core substrates emerged as the star technology of the conference, with standing-room-only sessions demonstrating ...
What happens when the world's thirst for artificial intelligence collides with physical limitations? The answer lies at the intersection of silicon innovation and packaging technology. From the conference hall of ECTC 2025 in Dallas, we're joined by Sam Naffziger of AMD who reveals how AI has transformed from a peripheral topic to the dominant force in computing within just five years. The economic motivation is clear: creating machines that generate intelligence offers "uncalculable value" ...
What happens when you gather 75 years of packaging innovation under one roof? The Electronic Component Technology Conference (ECTC) has transformed from a modest gathering of 300 electronics professionals to a powerhouse event attracting over 2,500 industry leaders, researchers, and visionaries. This remarkable journey reflects how advanced packaging has evolved from supporting technology to the driving force behind modern electronics. In this special episode, we speak with three generations...
Pratyush Kamal explains how 3DIC technologies are transforming semiconductor design as Moore's Law slows, requiring closer integration between chip and package design to maximize performance. • Traditional chip design treated packaging as an afterthought with designers "throwing designs over the wall" • Economic realities of advanced nodes mean companies now pay more for smaller transistors, driving chiplet adoption • Thermal challenges multiply in 3D stacks as power density doubles with eac...
Andrew Mathers, Principal Product Line Manager at Nordson Test and Inspection, discusses the revolutionary advancements in 3D x-ray inspection technology and how they're improving semiconductor manufacturing quality. • X-ray inspection requires high resolution, speed, and cost-effectiveness to drive better product quality • Traditional 2D radiographic imaging is being replaced by 3D imaging for more stringent manufacturing requirements • Planar CT imaging suffers from artifacts when inspecti...
The IEEE MTTS International Microwave Symposium attracts over 9,000 attendees and 500+ exhibitors to share cutting-edge developments in RF, microwave, and advanced packaging technologies. Tim Hancock and Jim Buckwalter from the IMS committee explain why this premier event, taking place in San Francisco's Moscone Center from June 15-20, has become increasingly relevant to professionals in advanced packaging and heterogeneous integration. • Approximately 15% of accepted papers directly address...
Acoustic inspection stands as a silent sentinel in semiconductor manufacturing, detecting microscopic defects that could lead to catastrophic failures in high-value applications. Bryan Schackmuth, Senior Product Line Manager at Nordson Test and Inspection, reveals how this technology has evolved from laboratory tools to production-line essentials. When ultrasound encounters even the tiniest air gap—we're talking hundreds of angstroms—it reflects completely, making acoustic imaging uniquely p...
Comments
Download from Google Play
Download from App Store
United States