EP003-屏蔽罩底下BGA本體破裂案例分析
Update: 2024-04-01
Description
這次要跟大家討論一個論壇網友提出來關於「屏蔽罩下BGA本體破裂」的案例。這是一張論壇上苦主貼出來關於「屏蔽罩下BGA本體破裂」的照片，這位苦主強調說，這顆本體破裂的BGA位於屏蔽罩的下方，在生產線做ICT電路組裝板測試的時候，因為出現"短路報錯"不良訊息後送檢，拆開屏蔽罩後發現BGA本體有破裂情形，苦主強調說不良率很低，到目前為止生產了10萬片板子，也只有這1片不良。所以應該就是個單一案例。
《部落格相關文章》
🛠️屏蔽框(Shielding frame)在PCBA的設計與生產注意事項 https://www.researchmfg.com/2010/08/shielding-frame/
🛠️把ICT(In-Circuit-Test)電路電性測試拿掉真的比較省錢嗎？ https://www.researchmfg.com/2015/02/removed-ict/
🛠️什麼是ICT(In-Circuit Test)與MDA(Manufacturing Defects Analyzer)？有何優缺點？ https://www.researchmfg.com/2015/01/ict/
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